Customized PCB Board Electronic Circuit Bare Board for Power Bank Lighting
Port:
Yantian, China
Production Capacity:
100000 Square Meter/Year
Payment Terms:
L/C, T/T, D/P, Western Union, Paypal, Money Gram
YIHAO CIRCUIT TECHNOLOGY LIMITED
Guangdong, China
Last Login Date:
Jul 30, 2020
Main Products:
FPC, Bare PCB, PCBA, PCB Borad, Multilayer PCB, PCBA Boards, SMT, Automobile Circuit Board, Commercial Circuit Board, Medical Circuit Board
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Product Description
Company Info
Basic Info.
Model NO.
YH632537
Type
Rigid Circuit Board
Flame Retardant Properties
V0
Dielectric
FR-4
Base Material
Insulation Materials
Epoxy Resin
Processing Technology
Electrolytic Foil
Application
Mechanical Rigid
Fexible
Material
Fiberglass Epoxy
Brand
Yihao
Layer
1-64
Certifications
UL; ISO9001; ISO14001; CQC; Iatf16949; SGS
Min Drilling Diameter
0.1mm
Applications
Medical; Telecommunications, etc
Trademark
YIHAO
Transport Package
Vacuum Packaging
Origin
HS Code
8534001000
Product Description
Welcome to Yihao Circuit Technology Co.,Ltd
Yihao is a one-stop PCB & PCBA solutions provider, offers PCB manufacturing, PCB assembly, components sourcing, stencils and PCBA testing services.
Lead Time
Production processes:
Material Receiving → IQC → Stock → Material to SMT → SMT Line Loading → Solder Paste/Glue Printing → Chip Mount → Reflow → 100% Visual Inspection → Automated Optical Inspection (AOI) → SMT QC Sampling → SMT Stock → Material to PTH → PTH Line Loading → Plated Through Hole → Wave Soldering → Touch Up → 100% Visual Inspection → PTH QC Sampling → In-Circuit Test (ICT) → Final Assembly → Functional Test (FCT) → Packing → OQC Sampling → Shipping
Certificates:
UL, ISO9001,ISO14001 ROHS and SGS , IATF
Yihao is a one-stop PCB & PCBA solutions provider, offers PCB manufacturing, PCB assembly, components sourcing, stencils and PCBA testing services.
| Files | Gerber, Protel, Powerpcb, Autocad, Cam350, etc |
| Material | FR-4, Hi-Tg FR-4, Lead free Materials (RoHS Compliant) , CEM-3, CEM-1, Aluminium, High frequency Material (Rogers, Teflon, Taconic) |
| Layer No. | 1 - 64 Layers |
| Board thickness | 0.0075"(0.2mm)-0.125"(3.2mm) |
| Board Thickness Tolerance | ±10% |
| Copper thickness | 0.5OZ - 4OZ |
| Impedance Control | ±10% |
| Warpage | 0.075%-1.5% |
| Peelable | 0.012"(0.3mm)-0.02'(0.5mm) |
| Min Trace Width (a) | 0.005"(0.125mm) |
| Min Space Width (b) | 0.005"(0.125mm) |
| Min Annular Ring | 0.005"(0.125mm) |
| SMD Pitch (a) | 0.012"(0.3mm) |
| pcb with green solder mask and LF-FREE surface finishing BGA Pitch (b) | 0.027"(0.675mm) |
| Regesiter torlerance | 0.05mm |
| Min Solder Mask Dam (a) | 0.005"(0.125mm) |
| Soldermask Clearance (b) | 0.005"(0.125mm) |
| Min SMT Pad spacing (c) | 0.004"(0.1mm) |
| Solder Mask Thickness | 0.0007"(0.018mm) |
| Hole size | 0.01"(0.25mm)-- 0.257"(6.5mm) |
| Hole Size Tol (+/-) | ±0.003"(±0.0762mm) |
| Aspect Ratio | 6:01 |
| Hole Registration | 0.004"(0.1mm) |
| HASL | 2.5um |
| Lead free HASL | 2.5um |
| Immersion Gold | Nickel 3-7um Au:1-3u'' |
| OSP | 0.2-0.5um |
| Panel Outline Tol (+/-) | ±0.004''(±0.1mm) |
| Beveling | 30°45° |
| V-cut | 15° 30° 45° 60° |
| Surface finish | HAL, HASL Lead Free, Immersion gold, Gold plating, Gold finger, immersion silver, immersion Tin, OSP, Carbon ink, |
| Certificate | ROHS ISO9001:2000 TS16949 SGS UL |
| Special requirements | Buried and blind vias, Impedance control, via plug, BGA soldering and gold finger |
Lead Time
| 1/2 | 4 | 6 | Above 8 | HDI | R-F PCB | |
| Sample Lead Time(Normal) (S≤m2) / days | 2-3/3-4 | 6-7 | 7-8 | 10-12 | 13-15 | 13-15 |
| Sample Lead Time(Fastest) (S≤m2) / days | 1/2/1 | 3 | 4 | 6 | 10 | 10-12 |
| Mass Production Lead Time(First Batch) / days | 4-5/5-7 | 7-10 | 10-12 | 15 | 18 | 15-18 |
Production processes:
Material Receiving → IQC → Stock → Material to SMT → SMT Line Loading → Solder Paste/Glue Printing → Chip Mount → Reflow → 100% Visual Inspection → Automated Optical Inspection (AOI) → SMT QC Sampling → SMT Stock → Material to PTH → PTH Line Loading → Plated Through Hole → Wave Soldering → Touch Up → 100% Visual Inspection → PTH QC Sampling → In-Circuit Test (ICT) → Final Assembly → Functional Test (FCT) → Packing → OQC Sampling → Shipping
Certificates:
UL, ISO9001,ISO14001 ROHS and SGS , IATF
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