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Fr-4 Single Lead Free PCB Board Electronic Components PCB Design Printed Circuit Program Manufacturer PCB Clone One-Stop Service OEM

Negotiable 1 Piece (MOQ)
Min. Order:
1 Piece
Port:
Shenzhen, China
Production Capacity:
50000 Square Meter/Year
Payment Terms:
L/C, T/T, D/P, Western Union, Paypal, Money Gram

Last Login Date:

Jul 30, 2020

Main Products:

FPC, Bare PCB, PCBA, PCB Borad, Multilayer PCB, PCBA Boards, SMT, Automobile Circuit Board, Commercial Circuit Board, Medical Circuit Board

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Product Description

Company Info

Basic Info.

Model NO.
YH521367
Type
Rigid Circuit Board
Flame Retardant Properties
V0
Dielectric
FR-4
Base Material
Insulation Materials
Metal Composite Materials
Processing Technology
Electrolytic Foil
Mechanical Rigid
Material
Brand
Yihao
Layer
1-64
Certificates
UL; ISO9001; ISO14001; CQC; IATF16949; SGS
Min Drilling Diameter
0.1mm
Trademark
YIHAO
Transport Package
Vacuum Packing
Specification
36*36*19
Origin
Made in China
HS Code
8534001000

Product Description

Welcome to Yihao Circuit Technology Co.,Ltd
 YIHAO is a one-step integrated manufacturer that designs and manufactures special structure PCB solutions. The company has a technical team composed of many experts with more than 20 years of experience, which can provide professional technical support for customers.  YOHAO can meet the needs of customers from development and design, rapid proofing, small batch trail prodution to mass production. 

FilesGerber, Protel, Powerpcb, Autocad, Cam350, etc
MaterialFR-4, Hi-Tg FR-4, Lead free Materials (RoHS Compliant) , CEM-3, CEM-1, Aluminium, High frequency Material (Rogers, Teflon, Taconic)
Layer No.1 - 30 Layers
Board thickness0.0075"(0.2mm)-0.125"(3.2mm) 
Board Thickness Tolerance±10%
Copper thickness0.5OZ - 4OZ
Impedance Control±10%
Warpage0.075%-1.5%
Peelable0.012"(0.3mm)-0.02'(0.5mm)
Min Trace Width (a)0.005"(0.125mm)
Min Space Width (b)0.005"(0.125mm)
Min Annular Ring0.005"(0.125mm)
SMD Pitch (a)0.012"(0.3mm)
pcb with green solder mask and LF-FREE surface finishing BGA Pitch (b)0.027"(0.675mm)
Regesiter torlerance0.05mm
Min Solder Mask Dam (a)0.005"(0.125mm)
Soldermask Clearance (b)0.005"(0.125mm)
Min SMT Pad spacing (c)0.004"(0.1mm)
Solder Mask Thickness0.0007"(0.018mm)
Hole size0.01"(0.25mm)-- 0.257"(6.5mm)
Hole Size Tol (+/-)±0.003"(±0.0762mm)
Aspect Ratio6:01
Hole Registration0.004"(0.1mm)
HASL2.5um
Lead free HASL2.5um
Immersion GoldNickel  3-7um  Au:1-3u''
OSP0.2-0.5um
Panel Outline Tol (+/-)±0.004''(±0.1mm)
Beveling30°45°
V-cut15° 30° 45° 60°
Surface finishHAL, HASL Lead Free, Immersion gold, Gold plating, Gold finger, immersion silver, immersion Tin, OSP, Carbon ink,
Certificate ROHS  ISO9001:2000  TS16949  SGS  UL
Special requirementsBuried and blind vias, Impedance control, via plug, BGA soldering and gold finger

Lead Time  
      1/2                  4            6      Above 8   HDI       R-F      
PCB
Sample Lead Time(Normal) (S≤m2) / days2-3/3-46-77-810-1213-1513-15
Sample Lead Time(Fastest) (S≤m2) / days1/2/13461010-12
Mass Production Lead Time(First Batch) / days4-5/5-77-1010-12151815-18

Production processes:
Material Receiving → IQC → Stock → Material to SMT → SMT Line Loading → Solder Paste/Glue Printing → Chip Mount → Reflow → 100% Visual Inspection → Automated Optical Inspection (AOI) → SMT QC Sampling → SMT Stock → Material to PTH → PTH Line Loading → Plated Through Hole → Wave Soldering → Touch Up → 100% Visual Inspection → PTH QC Sampling → In-Circuit Test (ICT) → Final Assembly → Functional Test (FCT) → Packing → OQC Sampling → Shipping

Certificates:

UL, ISO9001,ISO14001 ROHS and SGS , IATF


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