Fr-4 Single Lead Free PCB Board Electronic Components PCB Design Printed Circuit Program Manufacturer PCB Clone One-Stop Service OEM
Negotiable | 1 Piece (MOQ) |
Min. Order:
1 Piece
Port:
Shenzhen, China
Production Capacity:
50000 Square Meter/Year
Payment Terms:
L/C, T/T, D/P, Western Union, Paypal, Money Gram
YIHAO CIRCUIT TECHNOLOGY LIMITED
Guangdong, China
Last Login Date:
Jul 30, 2020
Main Products:
FPC, Bare PCB, PCBA, PCB Borad, Multilayer PCB, PCBA Boards, SMT, Automobile Circuit Board, Commercial Circuit Board, Medical Circuit Board
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Product Description
Company Info
Basic Info.
Model NO.
YH521367
Type
Rigid Circuit Board
Flame Retardant Properties
V0
Dielectric
FR-4
Base Material
Insulation Materials
Metal Composite Materials
Processing Technology
Electrolytic Foil
Application
Mechanical Rigid
Material
Brand
Yihao
Layer
1-64
Certificates
UL; ISO9001; ISO14001; CQC; IATF16949; SGS
Min Drilling Diameter
0.1mm
Trademark
YIHAO
Transport Package
Vacuum Packing
Specification
36*36*19
Origin
Made in China
HS Code
8534001000
Product Description
Welcome to Yihao Circuit Technology Co.,Ltd
YIHAO is a one-step integrated manufacturer that designs and manufactures special structure PCB solutions. The company has a technical team composed of many experts with more than 20 years of experience, which can provide professional technical support for customers. YOHAO can meet the needs of customers from development and design, rapid proofing, small batch trail prodution to mass production.
Files | Gerber, Protel, Powerpcb, Autocad, Cam350, etc |
Material | FR-4, Hi-Tg FR-4, Lead free Materials (RoHS Compliant) , CEM-3, CEM-1, Aluminium, High frequency Material (Rogers, Teflon, Taconic) |
Layer No. | 1 - 30 Layers |
Board thickness | 0.0075"(0.2mm)-0.125"(3.2mm) |
Board Thickness Tolerance | ±10% |
Copper thickness | 0.5OZ - 4OZ |
Impedance Control | ±10% |
Warpage | 0.075%-1.5% |
Peelable | 0.012"(0.3mm)-0.02'(0.5mm) |
Min Trace Width (a) | 0.005"(0.125mm) |
Min Space Width (b) | 0.005"(0.125mm) |
Min Annular Ring | 0.005"(0.125mm) |
SMD Pitch (a) | 0.012"(0.3mm) |
pcb with green solder mask and LF-FREE surface finishing BGA Pitch (b) | 0.027"(0.675mm) |
Regesiter torlerance | 0.05mm |
Min Solder Mask Dam (a) | 0.005"(0.125mm) |
Soldermask Clearance (b) | 0.005"(0.125mm) |
Min SMT Pad spacing (c) | 0.004"(0.1mm) |
Solder Mask Thickness | 0.0007"(0.018mm) |
Hole size | 0.01"(0.25mm)-- 0.257"(6.5mm) |
Hole Size Tol (+/-) | ±0.003"(±0.0762mm) |
Aspect Ratio | 6:01 |
Hole Registration | 0.004"(0.1mm) |
HASL | 2.5um |
Lead free HASL | 2.5um |
Immersion Gold | Nickel 3-7um Au:1-3u'' |
OSP | 0.2-0.5um |
Panel Outline Tol (+/-) | ±0.004''(±0.1mm) |
Beveling | 30°45° |
V-cut | 15° 30° 45° 60° |
Surface finish | HAL, HASL Lead Free, Immersion gold, Gold plating, Gold finger, immersion silver, immersion Tin, OSP, Carbon ink, |
Certificate | ROHS ISO9001:2000 TS16949 SGS UL |
Special requirements | Buried and blind vias, Impedance control, via plug, BGA soldering and gold finger |
Lead Time
1/2 | 4 | 6 | Above 8 | HDI | R-F PCB | |
Sample Lead Time(Normal) (S≤m2) / days | 2-3/3-4 | 6-7 | 7-8 | 10-12 | 13-15 | 13-15 |
Sample Lead Time(Fastest) (S≤m2) / days | 1/2/1 | 3 | 4 | 6 | 10 | 10-12 |
Mass Production Lead Time(First Batch) / days | 4-5/5-7 | 7-10 | 10-12 | 15 | 18 | 15-18 |
Production processes:
Material Receiving → IQC → Stock → Material to SMT → SMT Line Loading → Solder Paste/Glue Printing → Chip Mount → Reflow → 100% Visual Inspection → Automated Optical Inspection (AOI) → SMT QC Sampling → SMT Stock → Material to PTH → PTH Line Loading → Plated Through Hole → Wave Soldering → Touch Up → 100% Visual Inspection → PTH QC Sampling → In-Circuit Test (ICT) → Final Assembly → Functional Test (FCT) → Packing → OQC Sampling → Shipping
Certificates:
UL, ISO9001,ISO14001 ROHS and SGS , IATF
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