HASL Multi-Layer PCB Assembly Circuit Board Fabrication with UL Certificate Customized Mobile PCB Circuit Board with Competitive Price for LED Automobile

US$1.00
1-499 Pieces
US$15.00
500-999 Pieces
US$13.00
1,000-4,999 Pieces
US$11.00
5,000-9,999 Pieces
US$8.00
10,000+ Pieces
Port:
Yantian, China
Production Capacity:
50000 Square Meter/Year
Payment Terms:
L/C, T/T, D/P, Western Union, Paypal, Money Gram

Last Login Date:

Jul 30, 2020

Main Products:

FPC, Bare PCB, PCBA, PCB Borad, Multilayer PCB, PCBA Boards, SMT, Automobile Circuit Board, Commercial Circuit Board, Medical Circuit Board

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Product Description

Company Info

Basic Info.

Model NO.
YH836901
Type
Rigid Circuit Board
Dielectric
FR-4
Material
Fiberglass Epoxy
Application
Consumer Electronics
Flame Retardant Properties
V0
Mechanical Rigid
Processing Technology
Electrolytic Foil
Base Material
Enig
Insulation Materials
Organic Resin
Layer
1-64
Certificates
UL; ISO9001; ISO14001; CQC; IATF16949; SGS
Min Drilling Diameter
0.1mm
Applications
Medical; Telecommunications;
Trademark
YIHAO
Transport Package
Vacuum Packing
Specification
750 × 1000
Origin
Shenzhen, China
HS Code
8534001000

Product Description

Welcome to Yihao Circuit Technology Co.,Ltd
Yihao is a one-stop PCB & PCBA solutions provider, offering PCB manufacturing, PCB assembly, components sourcing, stencils and PCBA testing services. 
 
FilesGerber, Protel, Powerpcb, Autocad, Cam350, etc
MaterialFR-4, Hi-Tg FR-4, Lead free Materials (RoHS Compliant) , CEM-3, CEM-1, Aluminium, High frequency Material (Rogers, Teflon, Taconic)
Layer No.1 - 64 Layers
Board thickness0.0075"(0.2mm)-0.125"(3.2mm) 
Board Thickness Tolerance±10%
Copper thickness0.5OZ - 4OZ
Impedance Control±10%
Warpage0.075%-1.5%
Peelable0.012"(0.3mm)-0.02'(0.5mm)
Min Trace Width (a)0.005"(0.125mm)
Min Space Width (b)0.005"(0.125mm)
Min Annular Ring0.005"(0.125mm)
SMD Pitch (a)0.012"(0.3mm)
pcb with green solder mask and LF-FREE surface finishing BGA Pitch (b)0.027"(0.675mm)
Regesiter torlerance0.05mm
Min Solder Mask Dam (a)0.005"(0.125mm)
Soldermask Clearance (b)0.005"(0.125mm)
Min SMT Pad spacing (c)0.004"(0.1mm)
Solder Mask Thickness0.0007"(0.018mm)
Hole size0.01"(0.25mm)-- 0.257"(6.5mm)
Hole Size Tol (+/-)±0.003"(±0.0762mm)
Aspect Ratio6:01
Hole Registration0.004"(0.1mm)
HASL2.5um
Lead free HASL2.5um
Immersion GoldNickel  3-7um  Au:1-3u''
OSP0.2-0.5um
Panel Outline Tol (+/-)±0.004''(±0.1mm)
Beveling30°45°
V-cut15° 30° 45° 60°
Surface finishHAL, HASL Lead Free, Immersion gold, Gold plating, Gold finger, immersion silver, immersion Tin, OSP, Carbon ink,
Certificate ROHS  ISO9001:2000  TS16949  SGS  UL
Special requirementsBuried and blind vias, Impedance control, via plug, BGA soldering and gold finger

Lead Time  
 1/246above 8HDI  R-F
 PCB  
Sample Lead Time(Normal) (S≤m2) / days       2-3/3-4 6-7 7-8 10-12 13-1513-15  
Sample Lead Time(Fastest) (S≤m2) / days  1/2/1 3 4 6 1010-12
Mass Production Lead Time(First Batch) / days  4-5/5-7 7-10 10-12 15 1815-18

Production processes:
Material Receiving → IQC → Stock → Material to SMT → SMT Line Loading → Solder Paste/Glue Printing → Chip Mount → Reflow → 100% Visual Inspection → Automated Optical Inspection (AOI) → SMT QC Sampling → SMT Stock → Material to PTH → PTH Line Loading → Plated Through Hole → Wave Soldering → Touch Up → 100% Visual Inspection → PTH QC Sampling → In-Circuit Test (ICT) → Final Assembly → Functional Test (FCT) → Packing → OQC Sampling → Shipping
Products Display:




Certificates:

UL, ISO9001,ISO14001 ROHS and SGS , IATF


 
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